Prathiksha Ramprasad Dhanpal
Ic Package and Systems Interconnect Engineer @Ampere
Santa Clara, CA, US
EMAILS
p••••••••@amperecomputing.com
MOBILE NUMBERS
+91 *********19
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WORK HISTORY
Jan 2023 — Present
Ic Package and Systems Interconnect Engineer @Ampere
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Santa Clara, CA, US
EDUCATION
2021
Texas A&M University
Master's degree, Mechanical Engineering
2002 — 2014
Venkat International Public School - India
High school
2016 — 2020
Ramaiah Institute Of Technology
Bachelor of Engineering, Mechanical Engineering
ABOUT PRATHIKSHA RAMPRASAD DHANPAL
Packaging Engineer @ Ampere Computing | M.S. in Mechanical Engineering from Texas A&M University
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