Prashant Kapil

About Prashant Kapil

With 13+ of experience in automotive electronics, I specialize in - s. At Napino Auto & Electronics Ltd, I support the - to meet demanding automotive performance and reliability standards.My work focuses on thermal system design, CAE/CFD analysis, and multiphysics simulations for products such as, –. I utilize simulation-led insights to optimize semiconductor layouts, manage heat dissipation, and enhance system robustness across various operating conditions.I collaborate closely with design, hardware, and validation teams to ensure compliance with technical guidelines and quality standards, contributing through. My approach emphasizes early risk identification, design trade-offs, and data-backed decision-making.Core strengths include- & , tDriven by a focus on compact, reliable, and high-performing designs, I aim to deliver thermal solutions that support innovation, efficiency, and sustainability in automotive electronic systems.

Experience

1. Research and Development Manager Cae & Cfd

   Napino Auto & Electronics Ltd

   Jul 2023 — Present · Gurugram, IN

   Product Development and optimization of automotive electronic products such as ECUs, BCMs, RR Units, DC-DC Convertors, and battery chargers to enhance performance and reliability.• Optimized selection of semiconductor component configurations (ICs, MOSFETs, diodes, BGA) to improve heat dissipation in electronic systems.• Reviewed and evaluated designs and project activities for compliance with technology guidelines and development standards, providing actionable feedback to improve product quality.• Developed and maintained DFMEA, test plans, and procedures to ensure adherence to quality and performance requirements.• Assisted cross-functional project teams, including internal and external partners, across all stages of mechanical and thermal development, encompassing design, validation, tooling, and testing.• Provided domain-specific expertise and leadership in mechanical and thermal design, supporting cross-organizational projects and driving innovation in design and development processes.• Applied Finite Volume Method (FVM) and Finite Element Analysis (FEA) techniques to solve Stress Analysis, Vibrational and Explicit dynamics (Drop) Analysis.• Selection of Epoxy, TIM, PU, Thermal Greases, PAD for optimized thermal dissipation. • Independently planned, scheduled, and executed thermal computations and analysis, delivered technical presentations, and documented results in detailed reports.• Tested components in the laboratory using equipment such as thermal chambers, environmental shock chambers, and vibration tables to validate designs.• Managed and nurtured relationships with internal and external development partners to facilitate mechanical and thermal design and development projects.• Improved thermal performance of metal-class and FR4 PCBs by implementing advanced cooling strategies and optimizing design configurations.

Education

• UPES

  Bachelor of Technology (B.Tech.), Aerospace Engineering

  2007 — 2011

• Indian Institute of Technology, Kanpur

  Flight Mechanics Course, Aerospace

  2010 — 2010