Pranay Nagrani
Semiconductor Packaging Development Engineer @ IBM | PhD @ Purdue
- Role
- Packaging Development Engineer at IBM
- Location
- West Lafayette, IN, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Pranay Nagrani
Hardware Developer at IBM with a focus on thermal-mechanical modeling, testing and…
Experience
Packaging Development Engineer
Apr 2025 — Present · Fishkill, NY, US
Thermal-mechanical modeling and testing of first-level and system-level semiconductor packages.
Education
National Institute of Technology Karnataka
Bachelor of Technology - BTech
2015 — 2019
Purdue University
Master of Science - MS
2019 — 2021
Purdue University
Doctor of Philosophy - PhD
2022 — 2025
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