Pradip Kumar Mishra
- Role
- Information Technology Infrastructure - Aps (Banking and Market Technology) at Bank of America
- Location
- Gurugram, IN
- LinkedIn followers
- 500 followers
Experience
Information Technology Infrastructure - Aps (Banking and Market Technology)
Apr 2023 — Present · Tokyo, JP
Supporting Banking Application Including regulatory application in Asia Pacific region\\\\nApplication Deployment, Retirement, Infra Refresh, Capacity enhancement Etc.\\\\nRegulatory application including Jasdec, Zengin, Arrownet, NRI IStar, Arrowhead, JNET, NTT, Colt, SoftBank, Simplex, JPX, TSE, OSE, Etc.\\\\n Handling programs of Data Center build, Network & Infrastructure (Servers, Storage, Middleware, Load balancer, etc.) build\\\\n Responsible for leading the cloud build project, UAT Env. build projects, Application testing and migration to Prod & BCP\\\\n Scoping, Planning, Scheduling, Execution & closing of Bank\'s major programs e.g, Data center build, OS remediation, EOL remediation, Application migration\\\\n Budgeting & forecasting of multiple programs and finding the opportunity to reducing cost between multiple programs\\\\n Coordination of the design, procurement, installation and integration with Corporate Network\\\\n Preparation of DC readiness before hardware delivery e.g. Survey, cable requirements, network circuits requirements\\\\n Responsible for tracking program\'s risk & dependencies, Highlighting those to management frequently\\\\n Change management for related program activties\\\\n Regulatory timely notification for scheduled regulatory related applications\\\\n Stakeholder management Internal (DCS Ops, Network, Hosting, Corp Security, Network Security, Legal, Audit, GIS Risk, Application owners, Senior management, Global PMO, Change Con, Capacity, Finance) & External (Rack vendors, Cabling Vendor, Material suppliers, Regulatory, Landlord Etc.)\\\\n Clear & Concise communication & weekly status update meeting with all stakeholders\\\\n \\\\n\\\\n \\\\n \\\\n\\\\n \\\\n
Education
State Board of Technical Education and Training
Graduation, Electrical, Electronics and Communications Engineering, A
2005 — 2008
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