Prabhakaran Murugesan
PCB & IC Package Substrate Design Engineer | NVIDIA | xIntel
- Role
- Senior Package Design Engineer at NVIDIA
- Location
- Bengaluru, KA, IN
- LinkedIn followers
- 500 followers
About Prabhakaran Murugesan
Over 9+ year of experience as PCB & IC Package Substrate Design Engineer in designs involving analog, mixed-signal, RF and High-speed signals in Commercial, Medical, R&D prototype and ATE (Automated Test Equipment) PCB boards and Package substrate.+ Skilled in designing boards starting from Schematic capture to Gerber and ODB++ generation and documentation.+Handsome knowledge in designing on ATE- Teradyne & Advantest testers like T6373, T6391, J750, UFLEX, 93K, REXT for VPC and CPC board designs+ Proficient in designing Highspeed Multi layer PCB designs utilizing blind, buried and micro vias, High Power, High Current and RF board using multiple EDA tools.+ Hands on experience in using multiple design tools like DxDesigner, Orcad Capture, Mentor Graphics Xpedition, Cadence Allegro Layout & Package Design, Concept HDL, Cam350, Valor+Working knowledge in logical net-listings, schematics usage, electrical and routing rules creation, signal and power integrity optimization
Experience
Senior Package Design Engineer
Jan 2026 — Present · Bengaluru, IN
Education
Devasakayam matric. HR. Sec. school
Higher Secondary, Mathematics and Computer Science
Devasakayam Matric. Hr. Sec. School
SSLC
Kamaraj College of Engineering and Technology
Bachelor's degree, Electrical and Electronics Engineering
Skills
- Leadership
- Electronics
- Microsoft Word
- Management
- Program Management
- Power Director
- Microsoft Excel
- Powerpoint
- Labview
- C++
- Programmable Logic Controller (Plc)
- Plc
- Autocad
- Customer Service
- Engineering
- Comsol
- Matlab
- C
- Programming
- Strategic Planning
- Testing
- Electrical Engineering
- Windows
- Microsoft Office
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