Prabhakar Marepalli
Package Thermal Engineer at AMD
- Role
- Package Thermal Engineer at AMD
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
Experience
Package Thermal Engineer
Jan 2025 — Present
SoC core thermal analysis - Interconnect thermals and reliability (package interconnects)- Server and client package thermals - TIM characterization- Thermal test vehicle design, setup and measurement
Education
Purdue University
Master’s Degree, Mechanical Engineering
2009 — 2012
The University of Texas at Austin
Doctor of Philosophy (PhD), Mechanical Engineering
2012 — 2015
Jawaharlal Nehru Technological University
Bachelor of Technology (BTech), Mechanical Engineering
2005 — 2009
Skills
- Simulations
- Latex
- Matlab
- Thermal Management
- C
- Heat Transfer
- Mathematica
- Simulink
- Fluid Mechanics
- Autocad
- Labview
- Finite Element Analysis
- Nanotechnology
- Solidworks
- C++
- Comsol
- Numerical Analysis
- Abaqus
- Computational Fluid Dynamics (Cfd)
- Cfd
- Mathcad
- Ansys
- Fortran
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