Ping Yen Hsieh
Ph.D. | Technical Product and Program Management | Integration & Defect Metrology | Semiconductor Patterning Innovation
- Role
- Senior Technical Product and Program Manager Technical Group Lead at ASML
- Location
- San Jose, CA, US
- LinkedIn followers
- 500 followers
About Ping Yen Hsieh
Senior technical expert and program manager with over 15 years of experience delivering high-impact technical programs in semiconductor manufacturing and advanced hardware development. Proven expertise in leading cross-functional teams to drive multi-million-dollar projects from conception through high-volume manufacturing and large-scale deployment. Highly skilled in strategic planning, end-to-end project lifecycle ownership, and complex stakeholder management. Leverages deep technical knowledge in system-level integration (hardware/software/firmware), materials science, and data-driven problem-solving to mitigate risk and achieve aggressive timelines.Program Management: • End-to-end project lifecycle ownership, Scrum/ Agile and Waterfall methodologies, JIRA, OKRs• Strategic roadmap and milestone setting, budget and resource management, risk mitigation• Cross-functional collaboration with global engineering and product team, customer engagement Technical Proficiency: • System-level integration (hardware, software, firmware), semiconductor processes (CVD, dry etch, EUV lithography)• Materials characterization (TEM, SEM, EDS/WDS, AFM, XPS, FTIR, UV/VIS, DSC, TGA)Analytics and Quality: • JMP®, Python, SQL, Design of Experiments (DOEs), Advanced Process Control (APC), Statistical Process Control (SPC), Root cause analysis (RCA), Failure mode and effects analysis (FMEA)
Experience
Senior Technical Product and Program Manager Technical Group Lead
Feb 2023 — Present · San Francisco, CA, US
Directed the end-to-end program for single-beam (SBI) product delivery, driving ramp-up to high-volume manufacturing (HVM) which contributed over 50 shipments and $250M in revenue.• Led a complex, cross-functional team of over 20 engineers to achieve the first Multi-beam (MBI) system power-on in 4 months at customer site, enabling over $75M in new business.• Managed advanced-module integration projects, enhancing SBI and MBI system capabilities to win over $50M in purchase orders.
Education
University of Maryland
Ph.D., Materials Science and Engineering
2006 — 2011
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