Pierre Vincent

WORK HISTORY

EDUCATION

ABOUT PIERRE VINCENT

Pierre Vincent received his M.Sc. degree in Microelectronics Engineering from the University of Montpellier (ISIM), France. He started his career in 1990 as an Analogue RF Design Engineer and Technical Group Leader at Thomson CSF Semiconductor, where he worked on projects for space, military and avionics applications. In he joined Infineon Technologies in Echirolles, France, during its start-up phase. He was responsible for setting up the analogue IC development for high speed optical networking applications. Pierre Vincent joined the Design and Systems Division of CEA-LETI in 2003. He has held various positions within the organisation, including Head of the Architecture and RF-IC Design Laboratory. His responsibilities included overseeing the development of systems and designs for various applications such as RFID, mmWave & Sub THz, UWB localisation, ULP radio for IoT, SOI FEM and RF-MEMS co-integration solutions. In 2015, he became head of the IC design and integrated solutions research department, which included four research laboratories covering imaging, microdisplays, power management, sensors and actuators, wireless connectivity, mmWave & Sub THz communications, electronics in harsh environments, and reflectometry. In 2020, Pierre Vincent joined the Systems Division of CEA-LETI as Deputy Director. In this role, he is responsible for managing cross-functional activities between systems, integrated circuit design and technology development. Throughout his career, Pierre Vincent has demonstrated expertise in various aspects of microelectronics engineering, including analogue RF development, IC design, system architecture and cross-functional leadership.