Pier Paolo Stoppino
Sr Manager R & d @TDK InvenSense
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WORK HISTORY
Sr Manager R & d @TDK InvenSense
Milano, IT
Owner and Responsible for Microphone Advanced package developmentCompetitive intelligence Concept Proposal / Product designCost and risk assessmentBudget and Schedule definition Market validation and Program approvalDevice tape outQualification and Pre-prod Ramp upMass Production release• Direct interface of customers: Apple, Samsung, Oppo, Huawei, MotorolaSW skills: Solidworks, Autocad, Draftsight, KIcad and other PCB and substrate design
EDUCATION
Politecnico di Milano
Master's degree
SKILLS
ABOUT PIER PAOLO STOPPINO
Open minded, proactive and ready to face and solve problems, fitting to different environments and getting the best from involved teams to match the targets.Strong and proven experience in different companies and enviroments. Expert in different Program Management methodologies: from Cascade / Gantt based to Scrum / Agile.Long experience in Semiconductors Packaging and Testing, covering wide class of products:TSSOP, SOIC, QFN, QFP, SiP, FlipChip, LGA, BGA, MEMS, Smart Cards, Multichip, Multi-stacked, eMMC, eModules, Security Products.Testing platforms: HP93K Eagle 364/564/800 iFLEX, uFLEX, T2K, V93K, J750/J750EX, UFLEX, PS400/800/1600, LTX PAX RF, LTX CS/MX/EX, Catalyst.2D/3D CAD tools Autocad, Draftsight, Solidworks
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