Phil Lafleur

Senior Vice President, Hardware Engineering @ORBCOMM

Ottawa, ON, CA
MOBILE NUMBERS
+91 *********19

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WORK HISTORY

Sep 2014 — Present

Senior Vice President, Hardware Engineering @ORBCOMM

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Responsibility for electrical, mechanical and manufacturing support and engineering services teams Development of next generation wireless products to meet performance, quality, cost and time to market goals Support of existing products throughout the life cycle Competitive analysis, strategy and product definition Continuous improvement of engineering processes and documentation Budgeting, planning and tracking of costs and objectives Building in DFT, DFM, DFx to improve quality and lower costs

EDUCATION

1996 — 1998

Carleton University

Master's, Electrical Engineering

SKILLS

Embedded SystemsMobile DevicesIntegrated Circuit DesignAntennasWirelessAntenna DesignHardware ArchitectureEmbedded SoftwareWifiElectrical EngineeringProduct DevelopmentRfManufacturingSatelliteElectronicsRf EngineeringPcb DesignTestingTelecommunicationsSatellite CommunicationsProduct ManagementEngineering Management

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Phil Lafleur — Senior Vice President, Hardware Engineering at ORBCOMM in Ottawa, ON, CA | Unifers