Philip Koekemoer

Snr Director of Engineering at Qualcomm

Role
Senior Director of Engineering at 高通
Location
San Diego, CA, US
LinkedIn followers
500 followers

About Philip Koekemoer

Firmware and Software development. Expert at software/firmware design methodologies, the software development life cycle and software development in C and C++ on various platforms including; Windows, embedded OS such as ThreadX and other custom deeply embedded OS running on ARM, x86 and other architectures.• Product development: 2G/3G/4G and TD-SCDMA modem development, 3GPP compliance verification and phone and ASIC/chipset life cycle and development. Cellular chipsets successfully brought to market.• Leadership: Set strategy for development teams, define goals, influence management, lead teams and manage direct reports. Report status to executive level management.• Planning and process: Define the development process, lead teams to create plans, create resource forecasts and prepare the plan of record for the new development.• Cross-functional management: Managed teams including ASIC development, Product Engineering, Hardware development, Software Development and Verification to deliver on product milestones.• Risk assessment and management: Track development progress, define metrics to measure progress, identify risk and develop risk mitigation plans and communicate risk to executive level.• Customer Management: Coordinate and synchronize external deliverables, co-ordinate internal and customer processes and act as direct contact with customer.

Experience

  1. Senior Director of Engineering

    高通

    Nov 2021 — Present

Education

  • University of Pretoria

    Masters of Engineering, Masters of Engineering Technology Management

    1998 — 2004

  • University of Pretoria

    Bachelors in Engineering, Electronic Engineering

    1991 — 1994

Skills

  • Integration
  • Project Planning
  • Program Management
  • Rf
  • Soc
  • Gsm
  • Testing
  • Firmware
  • Modems
  • Project Management
  • Fpga
  • Embedded Software
  • Asic
  • Baseband
  • Mobile Communications
  • Embedded Systems
  • Ic
  • Semiconductors
  • Wcdma
  • Hsdpa
  • Umts
  • Processors
  • 3gpp
  • Wireless
  • Cross-Functional Team Leadership
  • Digital Signal Processors

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