Phil Germann
Hardware Engineering Leader
- Role
- all Cores Engineering Full Chip Physical Design at Intel
- Location
- Austin, TX, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Phil Germann
I have led several engineering teams spanning hardware development skills. Most…
Experience
all Cores Engineering Full Chip Physical Design
Jan 2025 — Present · Austin, TX, US
Education
University of Minnesota-Twin Cities
MS
South Dakota State University
BS
Skills
- Electrical Engineering
- Hardware Design
- Signal Integrity
- Chip Packaging
- System Design
- System Floorplanning
- Electrical Modeling and Simulation
- Power Distribution Analysis
- Hardware Characterization and Measurement
- Interface Budgeting and Timing
- Supplier Evaluation
- Design for Manufacturing
- Design Review
- Project Planning
- Resource Estimation
- People Management
- Team Leadership
- Leadership Mentoring
- Chip Physical Design
- Chip Timing
- Patent Development
- Publication Writing
- Project Management
- Hardware Architecture
- Characterization
- Hardware
- Patents
- Asic
- Management
- Integration
- Systems Engineering
- Program Management
- Debugging
- Microprocessors
- Semiconductors
- Electronics
- Ic
- Physical Design
- Timing Closure
- Circuit Design
Find verified contacts for anyone on LinkedIn
Unifers gives sales teams verified emails and direct dials, enriched profiles, and outreach that lands in the inbox.
Free plan included · No credit card required
This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.