Peter Sommerfeld

WORK HISTORY

EDUCATION

SKILLS

ABOUT PETER SOMMERFELD

Peter earned his Dipl-Ing.(FH) in Engineering Physics from the Fachhochschule Aachen, Germany, in 1988, a BSc Hons in Applied Physics from Coventry University, England, also in 1988, and a PhD in Physics from the University of Birmingham, England, in 1992. After 3 years of research in Solid State Physics at the Eindhoven University of Technology, the Netherlands, he joined the Technology group of Philips Mikroelektronik Module in Krefeld, Germany, working on packaging and interconnection technology for automotive electronic modules. In he was appointed head of the development department, taking over the responsibility for design and project management at Philips Mikroelektronik Module. As Philips Mikroelektronik Module was spun-off into TechnoFusion GmbH, Peter restructured the development department into a matrix organization, making project management more flexible and efficient. In June 2002 International Rectifier acquired TechnoFusion GmbH and Peter became Director R&D for the Krefeld design center. In August 2006 Peter was appointed to Director of Program Management responsible for all programs for Automotive Systems worldwide. In April 2007 Vishay Intertechnology acquired the Automotive Systems Group from International Rectifier and Peter was appointed to Director of Marketing with worldwide responsibility for the Automotive Systems group. In April 2008 the Automotive Systems Group was acquired by an American investor and is now independently run after an MBO. Peter has taken over responsibility for worldwide Marketing & Sales. The Company was renamed to Electronic Motion Systems to emphasize the expertise in design and manufacture of motor control electronics. In mid 2012 Peter took responsibility for Program Management and Engineering at Electronic Motion Systems. In July 2014 Electronic Motion Systems was acquired by KSR International. Specialties- Sales strategy and planning - Marketing research and assessment. Generating Marketing Plans - Program Management - Background in packaging technology for electronic modules