Peerapol Tinnakornsrisuphap

About Peerapol Tinnakornsrisuphap

Proven records of R&D leadership in bringing novel features to reality from conceptualization, design, simulation, prototype, field test and performance evaluation, standardization, technical marketing and commercialization• Ability to quickly grasp new and complex subjects and identify innovative solutions (100+ US patents granted)• Technical breadth and depth in areas including Network architecture and protocols, Large scale systems, Smart algorithms (machine learning, self-organizing), Wi-Fi, Cellular, Mesh and Hybrid Heterogeneous Networks, Applications & Services (multimedia, location-based, user experience & automation)

Experience

1. Principal Engineer Manager

   高通

   Jan 2020 — Present

   Systems Engineering Lead – Wireless Distributed ComputeLead a team of systems engineers on end-to-end wireless distributed compute architecture for XR- Distributed Split Compute Architecture: Architected a novel framework that dynamically adapts computing functions (rendering, perception, AI) across a constellation of devices (phone, glasses, smartwatch, compute puck, edge & cloud servers). The framework optimizes tradeoff between compute capabilities, communication link conditions & requirements, power consumptions and user experiences- System-level tradeoff analysis: Led system-level analysis to define optimal connectivity strategies for user experiences, balancing Micro-power Wi-Fi vs. Bluetooth for low power and Wi-Fi vs. UWB for high bandwidth/low latency scenarios- Cross-Functional Leadership: Coordinate a cross-disciplinary team to validate end-to-end performance and trials with mobile operators.

Education

• Chulalongkorn University

  B.Eng., Electrical Engineering

  1994 — 1998

• University of Wisconsin-Madison

  M.S., Electrical Engineering

  1998 — 2000

• University of Maryland

  Ph.D., Electrical Engineering

  2000 — 2004