Payam Haghparast

Ic Packaging Specialist, Thermal and Mechanical Analyst, Cfd Fea @Semtech

Ottawa, ON, CA

Duties & Responsibilities* Thermal Analysis (Flotherm, Ansys Icepak)* Mechanical Simulation (Probing, Wire bonding.)* Board Level Reliability (BLR)* CFD and FEA simulation in ANSYS.* Advanced thermomechanical simulation and optimization of IC packages including WLCSP, QFN, BGA, CBGA, eWLB, FCCSP.* Stress and strain analysis, creep modeling, plastic deformation, vibration, and material analysis.* Heat Sink Design* Thermal interface material selection focusing on performance and reliability.* Board Level Reliability (Drop test, Bending test, Thermal cycling test, Vibration test.)* Familiar with packaging industry standards (IPC, JEDEC, ISO, ANSI)*Hotsopt Analysis of Finfets* Daisy chains and BGA DC resistance analysis*Optical Beam Induced Resistance Change (OBIRCH)* Spherical, Monotonic (Static), and Cyclic Dynamic Bending Tests (experimentally and numerically)* Circuit Level Thermal Study* Numerical Drop Test Simulation* Various HTOL Tests* Reflow thermal stress simulation* Wire bond fatigue* QSFP_DD Thermal simulation and its optimization* Polyimide, Nitride layer, Al Metal, Solder, UBM, RDL. optimization in WLCSP packages to control the Nitride Tension Stress* Dye and Pry testing* BGA Microstructure failure analysis* Polyimide Delamination Sim and analysis* substrate warpage optimizations in terms of copper density* Substrate Deflection Simulation in Electrical Socket Testing* PCB Thermal Dissipation Analysis and Optimization (PCB Thermal Management Techniques)* GaAs, Silicon, GaN. die strength study* Preparing POD and LP and their calculations* Reflow cool down rate effect study on failures in several packages.* Ansys HFSS, Ansys Mechanical, and Ansys Icepak integration to have more accurate simulations.* Effect of epoxy delamination on heat dissipation through the board.* Leica microscope measurements (ball height using profile function, diameter.)* Package detail 3D models (step files)

Université de Sherbrooke

PhD

Shahid Bahonar University of Kerman

Bachelor's degree

Ferdowsi University of Mashhad

Master's degree