Paul Nalam
Module Development Engineer @ Intel | NSF \'Future of Semiconductors\' Award Recipient | Enhancing Semiconductor Manufacturing with Data-Driven Process Development/Optimization
- Role
- Watd Process Development Engineer - Advanced Packaging at Intel
- Location
- Beaverton, OR, US
- LinkedIn followers
- 500 followers
About Paul Nalam
My expertise lies in employing advanced data analytics tools to address intricate…
Experience
Watd Process Development Engineer - Advanced Packaging
Jul 2025 — Present
Education
The University of Texas at El Paso
Doctor of Philosophy - PhD, Mechanical Engineering
2020 — 2023
JNTUH College of Engineering Hyderabad
Bachelor of Engineering (B.E.), Metallurgical Engineering
2011 — 2015
The University of Texas at Arlington
Master's degree, Material science and engineering
2015 — 2017
Johnson Grammar School ICSE & IB
Indian certificate of secondary education
1997 — 2009
Kendriya Vidyalaya
12th CBSE, MBiPC
2009 — 2011
University at Buffalo School of Engineering and Applied Sciences
Master's degree, Materials Design and Innovation
2018 — 2019
Find verified contacts for anyone on LinkedIn
Unifers gives sales teams verified emails and direct dials, enriched profiles, and outreach that lands in the inbox.
Free plan included · No credit card required
This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.