Paul Price

About Paul Price

With over 20 years of experience in the semiconductor industry, I am a seasoned leader and technical sales-cycle architect with a proven track record of achieving aggressive objectives and goals. My expertise includes semiconductor design, manufacturing, and EDA.I have a wealth of experience managing technical engineering teams on a global, regional, and customer-specific level. I have a strong track record of success in organizing and deploying resources for complex pre-sales campaigns, solutions integration, product training, and post-sales execution. My peers and colleagues recognize me as an energetic leader, a strong motivator, and an excellent communicator.I possess a deep understanding of customer needs and can provide solutions that meet their needs. I am able to work effectively with cross-functional teams to drive business growth. I am always seeking to stay current with the latest trends and technologies in the industry.My extensive technical background and ability to think strategically make me a valuable asset to any organization. I am eager to leverage my experience and skills to drive success for my current and future clients.

Experience

1. Vice President, Applications Engineering Americas, Siemens Eda

   Siemens Digital Industries Software

   Jan 2021 — Present · US

Education

• Rose-Hulman Institute of Technology

  BSEE, Electrical Engineering

• Cornell University

  Master of Engineering (MEng), Electrical and Electronics Engineering

  1991 — 1992

Skills

• Team Management
• Start-Ups
• Verilog
• Fpga
• Asic
• Tcl
• Application-Specific Integrated Circuits (Asic)
• Long-Term Customer Relationships
• Ic
• Static Timing Analysis
• Integrated Circuits (Ic)
• Semiconductors
• Rtl Design
• Testing
• Soc
• Product Management
• Vlsi
• Management
• Dft
• System on a Chip (Soc)
• Embedded Systems
• Eda
• Debugging
• Engineering