Paul Cooper

Experience

1. Hardware Engineer Ii Quantum

   Microsoft

   Oct 2022 — Present · Redmond, WA, US

   Microsoft’s Quantum research group is exploring ways to build a full-stack quantum computer and has become the world’s center of expertise on topological quantum computing. The research effort includes theoretical and experimental teams around the world, who have been designing and optimizing all aspects of the quantum computer, from topological qubit designs to cryogenic control and readout circuitry, to runtime software and quantum language compilers. Microsoft Quantum will change the world of computing and help solve some of humankind’s currently unsolvable problems. As part of Microsoft’s Azure Quantum hardware team, I specialize in semiconductor packaging engineering for scalable quantum computing systems. I design and develop advanced packaging solutions for next-generation quantum processors, focusing on ultra-low-temperature operation, high-density integration, and mechanical reliability to support qubit performance and system scalability.Key Responsibilities: • Engineer cryogenic-compatible packaging for quantum chips and interposers, ensuring material and structural integrity from 300K to millikelvin temperatures. • Lead material selection, mechanical design, and simulation (FEA/thermal) for non-magnetic, low-CTE packaging architectures. • Collaborate cross-functionally with quantum device physicists, nanofabrication engineers, and system integration teams to deliver robust hardware ready for qubit validation and scaling. • Develop and implement high-precision assembly processes for die attach, thermal interfaces, wirebonding, and advanced interconnect technologies. • Evaluate stress mitigation strategies and their impact on qubit coherence and device yield through lab-based cryogenic testing and analysis.• Lead packaging development that includes prototyping new package structures across a global platform to the unique requirements of quantum devices.