Pat Leahey

About Pat Leahey

I am an experienced Strategic Engineering Leader with more than 25 years of experience working in thin film solutions and semiconductor development. I started my career at Lockheed Martin in support of NASA, where I contributed to the development of the Hubble Space Telescope before moving into the semiconductor and thin films industry. I believe that the discipline and detail-orientation of engineering help drive innovation and create opportunities for business growth.In my career, I have worked my way up from design engineering roles in Aerospace into team management and then strategic management and new product introduction for semiconductor devices and other conductive materials. I rely on my years working directly on products to help inform the decisions being made at the C-level – bringing real hands-on expertise into the executive planning, product development, and sales process. Being part of the evolution of IoT, cloud computing, renewable energy, and conductive materials industries give me ever-changing opportunities to work with innovators who are shaping our world – from faster processing to the touch screens we all take for granted, I have had a front row seat as new products shape our world.Now, I help define large-scale materials engineering processes – bringing a balance of business needs, market demands, engineering requirements, and product management together to help manufacturers deliver the products that support our modern world – semiconductors, SSD & HDD data storage, digital display, solar energy technology, and many other essential tools we rely on every day. Large P&L management in achieving key business objectivesDriving growth in engineering business to differentiate from the competitionEngineering and R&D division management – on-shore and off-shore teamsStrategic technology leadership guiding business environmentBroad technology and engineering knowledgeNew Product Introduction and Product Management

Experience

1. Senior Managing Director of Global Engineering and Customer Satisfaction

   Intevac

   Jun 2015 — Present · San Francisco, CA, US

   Global Product Engineering, New Product Introduction & Customer Satisfaction for product portfolio including Advanced Panel Packaging Semiconductor production equipment for Etch & RDL PVD Sputter, Hard Disk Drive magnetic sputter and DLC Carbon corrosion, Solar PVD Metalization & Implant TOPCON Solar Cell production and Front End Silicon and Metal Etch. • Lead engineering and process team for process qualification of Advanced Semiconductor panel packaging system including 3D and 2.5D multi-layers. The system successfully processes glass and silicon panels for degas, Ion beam Etch and PVD Metal seed Layer deposition, Descum and Via Etch application on >500 mm square panels. Panel packaging system provides extended capability, for planar etch and Via etch singulation, PVD seed layer metalization, and in situ plasma PR & Polymer clean for back-end advanced packaging manufacturing center.• Executive with a proven track record of leading teams in developing and launching multiple industry products. Global channel sales development and sales contract negotiations. • Manage Global product engineering team US, Asia, and EU for HDD magnetic media, Solar Wafer PVD & Implant, and Semiconductor Advanced Panel packaging systems. Responsible for QA/QC and reliability of customer product delivery and MTBF calculation. Specialties: Process Equipment & Technology for Semiconductor, Solar Cell fabrication Implant and Metal layer PVD deposition for TOPCON process and Hard Disk Drive Magnetic Metal PVD Sputter and DLC Carbon CVD deposition, Global RD & E, Operations, Customer Satisfaction, and Sales Strategy

Education

• Penn State University

  Bachelor of Engineering - BE, Mechanical Engineering

  1980 — 1985