Pascal Mora
Head of Service Dtnm @Cea-Liten
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WORK HISTORY
Head of Service Dtnm @Cea-Liten
Grenoble, FR
EDUCATION
Grenoble INP - UGA
PHD, NVM Characterization & Reliability
Ecole Nationale Superieure de Physique de Grenoble
Physics - Semiconductors - Optoelectronics -
Universite de Provence (Aix Marseille)
Master (MST), Analysis - Control - Physic of Material
SKILLS
ABOUT PASCAL MORA
Since December 2024 Head of service @ DTNM CEA Liten March 2020 to December 2024 Central LAB group Manager Test - Characterization - Reliability - Instrumentation - Packaging & Mask Teams September 2016 to March 2020 Device Analysis, Reliability & Product Application group Manager November 2014 to September 2016 LED technology reliability - Device to product reliability project management - support nanowire LED R&D and process development - define/implement device & product qualification plans - benchmark / challenge test methodologies to ensure relevent and accurate models Aledia 20••••14 FEOL reliability - 32/28nm High-K Metal Gate & 28FDSOI reliability & qualification - supported development/qualification of 32/28nm Low Power HKMG FEOL (GDI, BTI, HCI)- benchmarked / challenged test methodologies to ensure results quality and model accuracy - provided a link between ST and its customers / foundries for reliability of HKMG technologies STMicroelectronics 20••••10 FEOL & BEOL 32/28nm HKMG reliability within ISDA - implemented/defined FEOL and BEOL qualification plans with partners - benchmarked/challenged test methodologies to ensure results quality - support development/qualification of 32/28nm LP and GP HKMG FEOL STMicroelectronics 20••••08 Reliability of eNVM - Led and supported development & qualification of memory devices - defined qualification plan for memory devices - worked with design/process teams to improve device perfomances STMicroelectronics 20••••06 Electrical characterization & reliability - characterized memory devices of advanced CMOS technologies - developed new characterization tools and methods - identified and tune key process steps to optimize memory reliability - designed of new structures to improve memory performances - supported qualifications of memory devices STMicroelectronics 2002 Process integration BEOL - characterized interconnections with SEM and FIB - electromigration tests Philips Semiconductors Specialties: Microelectronics- Micro Display – Light Emitting Diode (LED) – Characterization – Device & product Reliability - Project management
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