Parastou Kazemi
Process Integration Engineer Lead at Intel Corporation
- Role
- Advanced 3d Packaging Integration Engineer at Intel
- Location
- Albuquerque, NM, US
- LinkedIn followers
- 500 followers
About Parastou Kazemi
6 years of experience in semiconductor (Si & device fabrication• Expertise in lithography, thin film deposition, wet/dry etching, e-beam evaporation and lift-off, PECVD, SEM, AFM• Device modeling and characterization • DC and RF testing• Working knowledge of TEM, DOE, R, Matlab
Experience
Advanced 3d Packaging Integration Engineer
Jan 2022 — Present
Education
The Ohio State University
Biomedical Engineering- Minor
2011 — 2013
The Ohio State University
Doctor of Philosophy (Ph.D.), Electrical and Electronics Engineering
2017 — 2019
The Ohio State University
B.S, Electrical and Computer Engineering
2011 — 2013
The Ohio State University
Master of Science - MS, Electrical and Electronics Engineering
2014 — 2017
Skills
- Pecvd
- English
- Sem
- Outlook
- E-Beam Deposition
- Ellipsometry
- Matlab
- X-Ray Diffraction Analysis
- Dspace
- Teaching
- Wet Chemical Etching
- L-Edit
- Chemical Vapor Deposition (Cvd)
- Microsoft Word
- Research
- Labview
- Lithography
- Simulations
- Photoluminescence
- Microsoft Office
- Silvaco
- Powerpoint
- Microsoft Excel
- Windows
- Spice
- Soldering
- Dry Etch
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