Ohidul Alam
Senior Development Manager, Chip Reliability @Lumentum
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WORK HISTORY
Senior Development Manager, Chip Reliability @Lumentum
Caswell, GB
EDUCATION
Bangladesh University of Engineering and Technology
MSc, Metallurgical Engineering
City University of Hong Kong
PhD, Reliability of Advanced Electronic Packages
Bangladesh University of Engineering and Technology
BSc, Metallurgical Engineering
SKILLS
ABOUT OHIDUL ALAM
Results-oriented professionals with a strong work ethic who takes initiatives, identifies problems and offers creative cost-effective and reliable solution • 1:1 BSc in Metallurgy, MSc in Material Engineering, PhD in Reliability of Flip Chip Electronic Packaging and “EU Marie Curie International Incoming Fellowship” in “Life Prediction using Mathematical Modelling of Fine-pitch Solder bumps technology in Microelectronics”.• Strong researching experience to understand the front-line technology and realization of the roadmap to implement that technology in a cost effective production process. Published >40 international peered review Journal papers (and presented in >20 Conferences) while engaged in academic research.• Previously experienced in micro-system product development – from concept design to detailed design, prototypes, pre-production, Highly Accelerated Life Testing of the sub-modules to capture any early design/process related failures. • Managed a small group of experienced engineers (mentoring the team –setting objectives, training, managing performance and appraisals); and also competent in project management (including budgeting, expenditure tracing etc)• Experienced in product qualification, reliability analysis (both physics-of-failure and statistical analysis), failure investigation, preparing DFMEA, and PFMEA, also FMECAs, FTA etc• Experienced in identifying/qualifying Low cost but reliable (on time and quality) suppliers, Material Approval, Cost reduction, Low Cost Roadmap with the suppliers. • Lab development/Pilot line commissioning (i.e, specification, selection and acquisition of capital equipment) experience both in University and Industry.Specialties: Reliability Engineering, Failure Investigation, FMEA, SEM, FIBSEM, TEMNew Production Introduction, High Temperature Electronics, Photonics, Laser Diode, Sensor packaging,Metallurgy, Joining Technology such as Soldering, Welding, Brazing, Adhesives, Metallization, Electromigration, Coating Technology, High temperature materials,
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