Nrup Balar

Flexible/Organic Electronics| Thin Film Engg./processing| Polymer Science| Mechanics & Reliability| Project Management

Role
Packaging R & d Engineer at Intel
Location
Chandler, AZ, US
LinkedIn followers
500 followers

About Nrup Balar

Technical Expertise:• Metrology / Materials Characterization- Mechanical - Tensile, Flexural, Creep, Stress relaxation- Fracture: 4-point bending, Double cantilever beam, fractography- Surface: AFM- Electrical: Solar/PV, Transistor, 2/4-probe - Optical: UV-Vis, Microscopy- Spectroscopy: Variable angle spectroscopic ellipsometry, XPS- Thermal: DMA, DSC• Semiconductor Device Fabrication- Thin film Processing/Casting/Printing- Spin-coating, Blade-coating, Shear assisted printing- Deposition: PVD, CVD, ALD- Wafer fab/dicing in class 100 and class cleanrooms• Programming / Software- MATLAB- OriginLab- MS Office (Word, Power point, Excel)- Automation: LabVIEW- Statistical Data Analysis- CAD - SolidWorks- Computational Analysis - ANSYS- Chemical Structure: Chem3D, ChemDraw• Soft Skills- Experience: 5 year academic research experience- Leadership and Collaboration: 10+ collaborations with cross-functional and multi-cultural scientists and engineers; mentored 5 undergraduate researchers; 9 scientific publications (4 more in preparation); presented 6 oral/posters at international conferences- Entrepreneurial, Regulatory, & Project Management: Executed the EHS protocols in the lab to handle hazardous chemicals; designed 3 experimental setups to process and characterize thin organic films (resulted in 6 research articles); prepared standard operating procedure (SOP)- Ownership & Problem Solving/Troubleshooting : Owned, troubleshot, and solved technical problems of 5 lab equipmentIndustrial Expertise: • Supply chain management- Vendor development: Onsight assessment - Sourcing: Commercial negotiation, PPAP- Project Management: Phase-GATE process- Product Development: FMEA, Tolerance analysis (Supporting role)• Soft Skills- Experience: 5 year industrial experience in the field of supply chain management and new product development (NPD) managing 9 NPD projects with annual revenue impact of $ 10M with total material productivity of $ 2M - Leadership and Collaboration: Established supply chain for 8 product lines; Managed supply of parts from 30+ vendors globally (North America, Europe, Asia); Supported VAVE and six sigma exercises to improve cost, quality, and lead time- Entrepreneurial, Regulatory, & Project Management: Certified internal auditor of ISO 9001:2008 for Ingersoll-Rand (I) Limited- Ownership & Problem Solving/Troubleshooting: Worked closely with vendors, engineering and quality teams to resolve quality issues and establish checks such as fixtures, post-processing inspection etc.

Experience

  1. Packaging R & d Engineer

    Intel

    Feb 2022 — Present · Chandler, AZ, US

Education

  • North Carolina State University

    Master of Science (M.S.), Mechanical Engineering

    2014 — 2016

  • North Carolina State University

    Doctor of Philosophy - PhD, Mechanical Engineering

    2016 — 2019

  • National Institute of Technology Calicut

    Bachelor of Technology (B.Tech.), Mechanical Engineering

    2005 — 2009

Skills

  • Pro Engineer
  • Engineering
  • Ansys
  • Mechanical Engineering
  • Catia
  • Finite Element Analysis
  • Matlab
  • Product Development
  • Fmea
  • Supply Chain Management
  • Machine Design
  • Heat Transfer
  • Production Planning
  • C
  • Pumps
  • Manufacturing Engineering
  • Design for Manufacturing
  • Root Cause Analysis
  • Procurement
  • Automotive

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Nrup Balar — Packaging R & d Engineer at Intel in Chandler, AZ, US | Unifers