Jinesh J Narangaparambil
Senior Reliability Engineer @Navitas Semiconductor
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WORK HISTORY
Senior Reliability Engineer @Navitas Semiconductor
Torrance, CA, US
Lead reliability qualification and system-level analysis of GaN power ICs, which includes automated/bench testing, failure analysis, and data modeling.• Work cross-functionally with the design, product, and overseas FA teams to drive NPI qualification, resolve challenges, and improve reliability coverage.• Prior thermal cycling and SMT process knowledge were used to achieve long-term board-level reliability qualifications, which aligned with key product goals.• To support continuous improvement, perform root cause analysis using SEM, EDX, X-ray, OBRICH, IROM, CSAM, TDR, TEM, FIB and statistical tools (JMP, DOE, and FMEA).• Device and Package evaluation through burn-in tests such as HTRB, HTGB, HTOL, HAST, TC and Power Cycle.
EDUCATION
Savitribai Phule Pune University
Bachelor’s Degree, Mechanical Engineering
Auburn University
Doctor of Philosophy - PhD, Mechanical Engineering
Auburn University
Master of Science (M.S.), Mechanical Engineering
ABOUT JINESH J NARANGAPARAMBIL
Experienced Reliability Engineer with a solid foundation in system-level reliability analysis and more than seven years of combined industry and academic experience developing, characterizing, and qualifying electronic systems and materials. At Navitas, I support NPI reliability validation, conduct root cause investigations, and collaborate cross-functionally to optimize device performance and longevity under various operating conditions.I hold a Ph.D. in Mechanical Engineering from Auburn University, where my research focused on printed electronics, including process development, mechanical and electrical performance testing, and long-term reliability studies in dynamic environments. Over the course of my Ph.D, I collaborated on projects with key industry partners, including NASA Marshall Space Flight Center, The Boeing Company, FLEX, NextFLEX, Toyota North America, MacDermid Alpha, and Jabil.Areas of expertise include:• System-level reliability and qualification• Reliability Physics Modeling• Device and package level testing (HTRB, HTGB, HTOL, HTSL, TC, Power cycle)• Thermo-mechanical fatigue and accelerated life testing (HAST, HALT)• Failure analysis and root cause diagnostics (SEM, EDX, X-ray, cross-sectioning, CSAM, FIB, OBRICH, IROM, TDR, TEM)• Cross-Functional Collaboration with Design, Manufacturing, Test, and Quality Teams • Statistical analysis and test development (DOE, FMEA, SPC)• SMT processes, ECA, encapsulation, and test fixture designSoftware tools: Solidworks, JMP, Reliasoft, MATLABOutside of engineering, I like Formula One racing, culinary science, travel, and spending time outdoors. I\'m also interested in community development, having served on graduate councils, foreign student advisory boards, and cultural organizations.Always open to collaboration, innovation, and meaningful conversation—feel free to connect!
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