Nitish Kumar
Packaging R&D Engineer/ Semiconductor Research Engineer (Thermals) at Intel Corporation
- Role
- Packaging R & d Engineer Semiconductor Research Engineer (Thermals) at Intel
- Location
- Phoenix, AZ, US
- LinkedIn followers
- 500 followers
About Nitish Kumar
Packaging R&D Engineer at Intel Corp. Technical Skills: Modeling and simulation of…
Experience
Packaging R & d Engineer Semiconductor Research Engineer (Thermals)
May 2021 — Present · Chandler, AZ, US
R&D Engineer in ATTD\'s Thermal Core Competency group Thermo-mechanical design and modeling of microelectronic packages New tools and methodology development for package design and analysis Thermal measurement and characterization of packages
Education
Purdue University
Master's degree
2013 — 2015
Indian Institute of Technology, Kanpur
B. Tech
2008 — 2012
Georgia Institute of Technology
Doctor of Philosophy (Ph.D.)
2015 — 2021
Skills
- Heat Transfer
- Mysql
- Fluid Mechanics
- Software Development
- Internal Combustion Engines
- Combustion
- Ansys Fluent
- Sql
- Cfd
- Data Analysis
- Analytics
- Html
- Fire Dynamic Simulator
- Solidworks
- Gas Turbines
- Microsoft Office
- Ansys
- C++
- Business Analysis
- Mentoring
- C
- Programming
- Java
- Matlab
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