Nishita Anandan
Packaging Research and Development Engineer
- Role
- Packaging Research and Development Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Nishita Anandan
Specializing in mechanics of materials and material characterization, I’ve amassed over 7…
Experience
Packaging Research and Development Engineer
Jun 2022 — Present · Hillsboro, OR, US
Education
University of Washington
Doctor of Philosophy - PhD, Mechanical Engineering
2014 — 2019
University of Washington
Master's degree, Mechanical Engineering
2012 — 2014
Indian Institute Of Information Technology Allahabad
Bachelor's degree, Mechanical Engineering(Design and Manufacturing)
2008 — 2012
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