Nishant Lakhera
Director, Semiconductor Packaging at NXP Semiconductors
- Role
- Director, Semiconductor Package Engineering at NXP Semiconductors
- Location
- Austin, TX, US
- LinkedIn followers
- 500 followers
About Nishant Lakhera
Delivering IC packaging solutions to the electronics industry.Specialties: Electronic Packaging and Packaging Structures (QFP, QFN, BGA, flip-chip, wafer level packaging, SOIC etc.)Electronic Packaging Materials (lead frames, substrates, die attaches, molding compounds, gels, dielectrics, thermal interface materials, solders, underfill etc.)Package reliability, assembly process, handling projects at OSATs from concept to high volume manufacturing.
Experience
Director, Semiconductor Package Engineering
Apr 2023 — Present · Austin, TX, US
Education
University of Wyoming
Ph.D., Mechanical Engineering, Material Sciences, Polymers
2009 — 2013
DIT UNIVERSITY
B.Tech, Mechanical Engineering
2002 — 2006
University of Wyoming
MS, Mechanical Engineering
2006 — 2009
Skills
- Data Analysis
- Experimental Design
- Microsoft Office
- Elastomers
- Technical Writing
- Dynamic Mechanical Analysis
- Interpersonal Skill
- Coatings Technology
- Research Writing
- Originlab
- Polymer Characterization
- Adhesives
- Mathematical Analysis
- Fast Learner
- Solidworks
- Research Analysis
- Scanning Electron Microscopy
- Research
- Polymers
- Matlab
- Polymer Science
- Communication Skills
- Hard Worker
- Materials Science
- Tensile Testing
- Failure Analysis
- Thermoplastic
- Adobe Acrobat
- Polymer Composites
- Leadership
- Structure-Property Relationships
- Statistical Data Analysis
- Uv Curing
- Smart Materials
- Thermoset
- Technical Documentation
- Mechanical Testing
- Design of Experiments
- Experimentation
- Ftir
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