Niranjan Parab
Packaging engineer
- Role
- Packaging Engineer at Intel
- Location
- Phoenix, AZ, US
- LinkedIn followers
- 500 followers
About Niranjan Parab
Aerospace engineer with more than 10 years of research experience in mechanics, manufacturing, and materials • Specialist in mechanical and materials characterization using wide array of experimental and numerical tools • Author of 35 publications in peer reviewed journals, including 10 first-author papers • Interdisciplinary collaborator with experience in working with partners in academia and private industry Complete list of publications: & hl=en
Experience
Packaging Engineer
Jan 2022 — Present · Chandler, AZ, US
Education
Indian Institute of Technology, Bombay
Bachelor of Technology (B.Tech.), Aerospace, Aeronautical and Astronautical Engineering
2006 — 2010
Purdue University
Master of Science (MS), Aerospace, Aeronautical and Astronautical Engineering
2010 — 2012
Purdue University
Doctor of Philosophy (PhD), Aeronautics/Aviation/Aerospace Science and Technology, General
2012 — 2017
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