Nilesh Hasabnis
Thermal Engineer @Frore Systems
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WORK HISTORY
Thermal Engineer @Frore Systems
San Jose, CA, US
Architected advanced air cooling solutions for Intel and Qualcomm platforms, enabling up to 2× sustained TDP in ultra-thin (600 W/cm² heat flux and 1,900 W+ AI GPUs, while improving junction temperature margins (~10°C reduction)- Optimized jet-impingement coldplates and coolant flow architectures to improve kW/LPM efficiency, reduce pressure drop and pumping power, and scale cooling solutions for next-generation high-power SoCs and AI accelerators- Delivered end-to-end thermal architecture and validation, including system-level CFD (Icepak/Fluent), lab testing, cross-functional execution, and launch of multiple production devices- Inventor on 7+ granted patents in advanced cooling technologies.
EDUCATION
Clemson University
Master of Science (M.S.), Mechanical Engineering
Maharashtra Institute of Technology
Bachelor of Engineering (BE), Mechanical Engineering
Indiana University Bloomington
Master of Science - MS, Data Science
SKILLS
ABOUT NILESH HASABNIS
Thermal Architect with 12+ years of expertise in system-level thermal architecture, specializing in direct-to-chip liquid cooling and advanced air cooling for high-power SoCs, AI accelerators, GPUs, and performance-driven consumer platforms. Proven record of enabling higher sustained compute density through high heat-flux management, coldplate optimization, and CFD-driven design, translating innovative concepts (7+ granted patents) into production-ready solutions. Recognized for cross-functional technical leadership, rigorous validation, and delivering scalable, high-reliability thermal systems from silicon to data center deployment.Open to contributing to forward-looking teams solving complex thermal challenges in next-generation computing systems.
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