Nicholas Alexander Polomoff
Heterogeneous Integration & Advanced Chiplet Packaging Technology Engineer at IBM AI Hardware Center
- Role
- Master Inventor at IBM
- Location
- New York, NY, US
- LinkedIn followers
- 500 followers
About Nicholas Alexander Polomoff
Nick is currently a member of the Far Back End of Line (FBEOL) chip to package…
Experience
Master Inventor
Oct 2024 — Present
Education
Clemson University
BS, Ceramic and Material Science and Engineering
1999 — 2004
University of Connecticut
Ph.D, Material Science and Engineering
2005 — 2011
University of Connecticut School of Business
MBA, Marketing, Finance, Management
2008 — 2010
University of Connecticut
MS, Material Science and Engineering
2005 — 2008
Skills
- R&D
- Cvd
- Engineering
- Nanomaterials
- Experimentation
- Design of Experiments
- Pvd
- Ftir
- Electrochemistry
- Research
- Photolithography
- Mechanical Testing
- Metallurgy
- Thin Films
- Tem
- Afm
- Physical Vapor Deposition (Pvd)
- Research and Development (R&D)
- Optical Microscopy
- Materials Science
- Failure Analysis
- Electron Microscopy
- Labview
- X-Ray Vision
- Metallography
- Semiconductors
- Polymers
- Physics
- Sputtering
- Scanning Electron Microscopy
- Microscopy
- Xrd
- Materials
- Characterization
- Powder X-Ray Diffraction
- Spectroscopy
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