Neel Mazumdar
Module Development Engineer at Intel | Product Development, Design, and Manufacturing | iPhone 16 and Microprocessor builder
- Role
- Module Development Engineer - Hybrid Bonding at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
About Neel Mazumdar
I love dreaming. And I prefer not to lose touch with reality. The space in between is…
Experience
Module Development Engineer - Hybrid Bonding
Jul 2024 — Present · Hillsboro, OR, US
Developing equipment and processes for advanced semiconductor packaging.• Equipment Engineering – system expert and owner• Product & Process Development – collaboration with process experts, factory managers, automation, and metrology• Manufacturing Operations – point of escalation for technicians in daily ops.TECHNOLOGIES- Wafer Level Assembly- Hybrid Bonding- Die-to-WaferPRODUCTS- Intel Xeon, memory chipsACHIEVEMENTS- Improved module production capacity by 33% through process improvement initiatives- Optimized equipment functionality, process flow, daily operations, and error responses- Qualified equipment and process changes through engineering testing, data collection, and analysis.
Education
University of Illinois Urbana-Champaign
Master of Engineering - MEng, Mechanical Engineering
Texas A&M University
Bachelor of Science - BS, Mechanical Engineering
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