Nedu Duraiswami

Sr Director Product Engineering, Quality Assurance, Reliability and Failure Analysis @SiTime

San Jose, CA, US
EMAILS
n••••••••@sitime.com
MOBILE NUMBERS
+14•••••••90

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WORK HISTORY

Feb 2022 — Present

Sr Director Product Engineering, Quality Assurance, Reliability and Failure Analysis @SiTime

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Santa Clara, CA, US

EDUCATION

N/A

National Institute of Technology, Tiruchirappalli

B.E.(Hons), Electrical and Electronics Engineering

N/A

Florida Institute of Technology

M.S, Electrical Engineering

SKILLS

Ic Electrical CharacterizationSemiconductor Quality Assurance and ReliabilityIc Thermal CharacterizationIcManufacturing ProductivityStatistical Process Control (Spc)Design of ExperimentsSpcSocYieldAnalogPower ManagementMixed SignalRfFailure AnalysisSemiconductor IndustryCmosIntegrated Circuits (Ic)PpapSemiconductorsSilicon and Microelectronic Package Process TechnologyEngineering ManagementData AnalysisSystem on a Chip (Soc)Radio Frequency (Rf)Situational LeadershipDftProject ManagementSiliconZero DefectsStacked Die PackagingAec_Q100 QualificationFmeaTeam BuildingYield ManagementSemiconductor Failure AnalysisMulti-Chip ModulesCharacterizationProcessor Power and Performance CharacterisationPower Management Ics

ABOUT NEDU DURAISWAMI

Semiconductor Automotive Functional Safety Professional (SC-AFSP) certified by SGS TUV for semiconductor IP/IC development and manufacturing to meet Automotive Functional Safety per ISO26262 and an Innovative Senior Engineering Management Professional recognized for successful team building and consistently enhancing performance and productivity of teams through creative improvements. Comprehensive background in semiconductor operations with demonstrated success supporting organizational goals of market leadership, growth and achieving profit through on-time NPI, on-time volume ramp, pro-active quality, creative cost reduction, on-time customer order fulfillment and total customer satisfaction. Experienced with all aspects of product development life cycle. Excellent problem solving skills with ability to simplify and communicate complex technical and non-technical information to cross functional audiences.Recognized for team building and enhancing competence and commitment of teams, Consistently facilitating clear communication between silos internal and external to the organization.Maintaining close business and technical relationships with world-wide manufacturing vendors (wafer foundries, assembly/test facilities, test service suppliers)- Semiconductor IP/IC development to meet Automotive Functional Safety standard per ISO26262 - Foundry, Package, Product,Test, Quality Assurance & Reliability,Technical Project Management- 40nm, 28nm, 14nm LPP FinFET, Copper interconnect development, Advanced Packaging - Analog,Mixed signal and RF product characterization and qualification- DFM,DFT,DFR,FMEA, FMEDA, TS16949, DOE, TPM, SPC, AEC_Q100, APQP, PFA,zero defect- Six Sigma Manufacturing, Operations Engineering Management- Manufacturing and Reliability Test HW & SW development and testing

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