Navjot Kaur Sidhu

Advanced Ic Packaging Integration Engineer @Intel

Chandler, AZ, US
MOBILE NUMBERS
+91 *********19

Signup · Get unlimited contacts

WORK HISTORY

Jul 2020 — Present

Advanced Ic Packaging Integration Engineer @Intel

View department →

AZ, US

EDUCATION

2011 — 2012

Binghamton University

Master of Science (MS), Electrical Engineering

2013 — 2015

Binghamton University

Doctor of Philosophy (PhD), Electrical Engineering

SKILLS

Wet Chemical EtchingPolymerizationSputteringImpedance SpectroscopyPhotolithographyOriginlabPhotoluminescenceLabviewPolymer CharacterizationSupercapacitorsCyclic VoltammetryElectrodepositionSemRaman SpectroscopyMatlabC++PecvdXpsPspiceTransition Metal OxidesPolymer NanocompositesReactive Ion EtchingElectrochemical Characterization

ABOUT NAVJOT KAUR SIDHU

Experience in Energy Storage Devices Based on Transition Metal oxides and Polymers Skills: Synthesizing, Designing, Physical/Chemical Characterization, Electrochemical Testing andCircuit Modeling. Experience in Thin Film Semiconductor Devices Fabrication - Clean RoomThin Film Transistors, Organic Light Emitting Diodes, Diffraction Gratings

This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.

Navjot Kaur Sidhu — Advanced Ic Packaging Integration Engineer at Intel in Chandler, AZ, US | Unifers