Nanette Quevedo
Package Technology Integrator at Micron Technology
- Role
- Package Technology Integrator at Micron Technology
- Location
- Boise, ID, US
- LinkedIn followers
- 500 followers
Information TechnologyView LinkedIn profile
About Nanette Quevedo
ENGINEERING PROFILE Performance-driven engineering professional with 20+ years’…
Experience
Package Technology Integrator
Nov 2014 — Present · Boise, ID, US
Education
New Era University, Quezon City
Bachelor's degree
1986 — 1991
Skills
- Failure Analysis
- Semiconductor Industry
- Jmp
- Copper Wirebond
- Silicon
- Metrology
- Process Engineering
- Surface Mount Technology
- Engineering
- Electronics
- Product Development
- Semiconductors
- True Spec Validation
- Ic
- Design of Experiments
- Manufacturing
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