Murali Kilaru
.
- Role
- Advanced Packaging Technologist at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
About Murali Kilaru
Technologist with expertise in converting concepts to High volume manufacturing in high tech industry • 14 years of expansive experience in semiconductor chip technologies with particular emphasis on technology, product development and high-volume scaling• Expert at identifying and driving operational cost reduction and margin improvement initiatives • Direct experience collaborating, negotiating to align on organizational targets for quarterly reviews.• 8+ years of leading Joint Development Projects (JDP), Leading cross-functional teams to achieve collective goals.
Experience
Advanced Packaging Technologist
Jul 2022 — Present · Hillsboro, OR, US
Education
University of Cincinnati
Masters, MEMS and nano structures
2005 — 2007
Skills
- Optics
- Characterization
- Photolithography
- Mems
- Thin Films
- Semiconductors
- Microfabrication
- Physics
- Sensors
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