Murali Dharan

About Murali Dharan

Currently working as package layout design engineer at Micron technology for the products(Flip chip/Wire bond), Memory IC (NAND, LPDDR, mNAND) Packages. Excellent skills IC Package layout design using Cadance APD/SIP softwareFamiliar with 2D Cad Design, CAM350Experience in PCB Design• Collecting inputs for design from client and estimating the design effort.• Handled ATE Probecards Load board,characterization & Burn in boards • Logic symbol creations and Schematic capture.• Moderate Knowledge of Library creation.• PCB layout designs as per industrial standards and as per customer requirements. • Setting the constraints (Design rules) according to design requirements.• Good knowledge and experience on High Density Interconnect (HDI) technology using Blind/Berried vias.• Good knowledge in Signal Integrity guidelines on PCB design (reflection noise, crosstalk noise, ground bounce etc.)• Good knowledge in EMI/EMC guidelines and implementation on PCB design.• Good knowledge in Power plane and Power supply requirements• Good knowledge in Analog, Digital and Analog-Digital mixed signals• Designing the PCB’s according to DFM (Design for Manufacturing) and DFA (Design for Assembly) techniques.• Deciding the PCBs Layer Stack-ups according to complexity of design and impedance matching requirements.• Validating the data for PCB manufacturing.• Involved in PCB fabrication process.

Experience

1. Package Layout Design Engineer

   Micron Technology

   Oct 2021 — Present · Hyderabad, IN

Education

• Goverment Polytechnic College,Coimbatore

  Diploma

  2011 — 2014