Muhammad Salahuddin Kabir
Advanced Packaging | Process Integration | Semiconductor Fabrication | Six Sigma
- Role
- Product Packaging Integration Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
About Muhammad Salahuddin Kabir
Experienced semiconductor process integration engineer with a Ph.D. in Microsystems…
Experience
Product Packaging Integration Engineer
Jul 2025 — Present · Hillsboro, OR, US
Education
Clemson University
Master of Science - MS, Materials Science and Engineering
2014 — 2016
Rochester Institute of Technology
Doctor of Philosophy - PhD, Microsystems Engineering
Military Institute of Science and Technology (MIST)
Bachelor of Science - BS, Electrical, Electronic and Communication Engineering
2008 — 2011
Skills
- Solar Cells
- Science
- Electropolishing
- Research
- Cisco Packet Tracer
- C
- Programming
- Thermal Evaporation
- Thin Films
- Plasma-Enhanced Chemical Vapor Deposition (Pecvd)
- Differential Scanning Calorimetry
- Wet Chemical Etching
- Optical Microscopy
- Latex
- Atomic Layer Deposition
- Microwind
- Spin Coating
- Matlab
- Tga
- Annealing
- Altera Quartus
- Materials Science
- Microsoft Office
- Vlsi
- Mathematical Modeling
- Digital Electronics
- Lithography
- Physics
- Powerpoint
- Signal Processing
- Scanning Electron Microscopy
- Simulations
- Semiconductor Device
- Dsch
- Sputtering
- Thin Film Characterization
- Microprocessors
- Semiconductor Fabrication
- Maple
- Pspice
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