Mohammad Abir Hossain
Semiconductor Process Development and Integration, Transistor Device Research and Yield Improvement, Intel 18A Gate All-Around Nanoribbon Transistor Process Development
- Role
- Process Integration Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
About Mohammad Abir Hossain
Results-oriented Process Integration Engineer with experience in semiconductor manufacturing, process optimization, and yield improvement. Proven ability to lead cross-functional integration efforts, design and analyze experiments, and drive process changes that improve performance, yield, quality, reliability and manufacturability in high-volume environments. Excellent communicator with a strong track record of collaborating with device, module, and yield teams to solve complex problems and support new technology ramps.
Experience
Process Integration Engineer
Apr 2024 — Present · Hillsboro, OR, US
Intel 18A Gate All-Around Nanoribbon Transistor Process Development:• End-to-end process integration for advanced semiconductor technology node, ensuring seamless interaction between FEOL, MOL, and BEOL modules to meet performance, yield, and reliability targets.• Developed, optimized, and qualified unit processes and integration schemes to improve device performance.• Drove yield improvement initiatives by identifying systematic defects, analyzing inline and electrical data, and partnering with module, yield, and failure analysis teams to implement corrective actions.• Performed data analysis and statistical process control (SPC) to monitor process stability, identify excursions, and ensure compliance with manufacturing specifications.• Owned process change management, including experiment design (DOE), risk assessment and execution of process changes.• Collaborated cross-functionally with process modules, device engineers, design, manufacturing, and equipment teams to resolve integration challenges and accelerate technology ramp.• Supported technology development and transter from R&D to high-volume manufacturing, ensuring robust process windows and manufacturability.• Conducted root cause analysis for electrical failures and parametric shifts using inline metrology, TEM/SEM analysis, and electrical characterization data.
Education
The University of New Mexico
Master of Science - MS, Mechanical Engineering
Bangladesh University of Engineering and Technology
Bachelor of Science - BS, Mechanical Engineering
University of Illinois Urbana-Champaign
Doctor of Philosophy - PhD, Mechanical Engineering
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