Mohamed Rabie
TCAD Engineer
- Role
- Semiconductor Engineer at IBM
- Location
- Clifton Park, NY, US
- LinkedIn followers
- 500 followers
About Mohamed Rabie
Inventor and Technologist in the areas of Semiconductor Packaging and Thermal and Mechanical Reliability of BEoL Interconnects• Experience: 14+ years in 2D/3D mechanical, thermal, and electrical modeling using Ansys and Synopsys tools• Leadership: Chief Technology Officer of a startup in the consulting business and 5+ years managing a small team focused on thermal and mechanical modeling of semiconductor BEoL and packaging structures• Business Achievement: Drove resolution of critical flipchip package failure issues by connecting teams across functions and resolving to closure leading to multimillion customer engagement• PhD in Electrical Engineering with focus on semiconductor process technology• Publications and Patents: 7 patent applications (4 issued), 2 invited talks, 155 citations, 21 publications including 1 book, 1 review article, 4 journal papers, and 15 papers at and modeling conferences
Experience
Semiconductor Engineer
Aug 2022 — Present
Education
McMaster University
M.A.Sc., Electrical and Electronics Engineering
2003 — 2004
McMaster University
Doctor of Philosophy (Ph.D.), Electrical and Electronics Engineering
2005
Ain Shams University
B.Sc., Computer Engineering
1995 — 2000
Skills
- Silicon
- Research
- Linux
- C
- Programming
- Microsoft Office
- Vlsi
- Numerical Analysis
- Tcad
- Cmos
- Matlab
- Algorithms
- Physics
- Eda
- Very-Large-Scale Integration (Vlsi)
- Semiconductors
- Simulations
- Electronics
- C++
- Tcl
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