Micah Morikuni
IC Package Design Integration Engineer @ Qualcomm | MS in Electrical Engineering
- Role
- Ic Package Design Integration Engineer at 高通
- Location
- San Diego, CA, US
- LinkedIn followers
- 500 followers
Experience
Ic Package Design Integration Engineer
Jul 2025 — Present · San Diego, CA, US
Education
Purdue University College of Engineering
Master of Science - MS, Electrical and Computer Engineering
Iolani School
High School Diploma
Purdue University College of Engineering
Bachelor of Science - BS, Electrical Engineering
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