Meysam Tabandeh-Khorshid
- Role
- Advanced Packaging R & d Engineer at Intel
- Location
- Portland, OR, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
Experience
Advanced Packaging R & d Engineer
Oct 2022 — Present
Skills
- Nanoparticles
- Mechanical Properties
- Powder Metallurgy
- Research
- Microsoft Office
- Jmp
- Grant Writing
- Scanning Electron Microscopy
- Design of Experiments
- Composites
- Tem
- R&D
- Materials
- Nanotechnology
- Volunteer Training
- Metallurgy
- Research and Development (R&D)
- Experimentation
- Castings
- Metal Matrix Composites
- Presentation Skills
- Metallography
- Teamwork
- Characterization
- Nanomaterials
- Materials Science
- Powder X-Ray Diffraction
- Analytical Skills
- Data Analysis
- Leadership
- Communication
- University Teaching
- Afm
- Nanocomposites
- Optical Microscopy
- Engineering
- Mechanical Testing
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