Mehdi Nabil

About Mehdi Nabil

For more than six years, I have specialized in silicon and package-level thermal management for mobile, automotive, and compute chipsets, as well as RF SiP and chiplet architectures, across multiple stages of product development. My expertise includes computational fluid dynamics (CFD) and finite element analysis (FEA), with a focus on IC packaging thermo-mechanical analysis, thermally driven floor planning, performance characterization of CPUs and GPUs under thermal constraints, assessment of thermal risks in high-temperature and high-voltage testing, and validation of thermo-mechanical models.

Experience

1. Sr Ic Packaging Thermal Engineer

   SpaceX

   Mar 2024 — Present · Irvine, CA, US

   Designing thermal solutions to enhance energy efficiency and performance scaling of RF SiP/chiplets at both the silicon die and semiconductor package levels* Optimizing advanced IC design schemes and floor plans to maximize thermal performance* Creating mechanical Finite Element Models at the IC package level to analyze stress and warpage, ensuring high yield* Developing thermal models using detailed package and PCB layouts to characterize package thermal resistance parameters such as θJA, θJB, and θJC* Creating thermal models for the ATE test setup to characterize thermal risk and improve performance by modifying the socket board and handler design* Collaborating with material suppliers and testing labs to characterize thermophysical properties required for thermo-mechanical modeling and validation* Analyzing simulation and measurement results to improve product thermal and thermal-mechanical management* Leading the evaluation and deployment of various software solutions for the System-in-Package team, aimed at enabling in-house thermal and thermal-mechanical modeling for RF SiP/chiplets

Education

• Penn State University

  Doctor of Philosophy (Ph.D.), Mechanical Engineering

  2015 — 2019

• Amirkabir University of Technology - Tehran Polytechnic

  B.Sc., Mechanical Engineering

  2006 — 2011

• Auburn University

  M.Sc., Mechanical Engineering

  2011 — 2013