Zubair Ebne Rafique

About Zubair Ebne Rafique

Research and Development Engineer at Intel Corporation. Developing next generation…

Experience

1. Packaging R & d Engineer (Si Design)

   Intel

   Oct 2022 — Present

   Drive research and development of advanced multi-die packaging solutions such as 2.5D/3D integration to enable next-generation product roadmaps. Work closely with cross-functional teams to translate performance targets and integration requirements into innovative packaging architectures. Conceptualize and assess novel techniques for integrating heterogeneous components and pushing the boundaries of packaging density, speed and power efficiency. Design, test and analyze sophisticated packaging test chips to push manufacturing capabilities in throughput, yields, reliability and interfaces. Provide data-driven insights to transform fab processes, equipment, materials and design tools. Partner extensively with teams from lithography, assembly, yield analysis, QnR, fault analysis and more to develop comprehensive packaging rules balancing manufacturing capabilities and stringent reliability, thermal and performance metrics. Communicate guidelines clearly through docs and workgroup/forums. Provide crucial packaging expertise enabling smooth implementation of high-volume revenue chips, from architecture recommendations (AC/AP/Cert) to mask design support, modeling, qualifications and production ramp. Identify cutting-edge packaging technologies through close connections with academia, industry consortia, vendors and conferences. Analyze technical merits and develop adoption roadmaps leveraging new techniques for future products.

Skills

• English
• Microsoft Word
• Strategic Planning
• Outlook
• Public Speaking
• Research
• Leadership
• Microsoft Excel
• Windows
• Photoshop
• Powerpoint
• Microsoft Office
• Teamwork