Naim Jahangir

About Naim Jahangir

I am a Module Development Engineer at Intel Corporation with hands-on experience in…

Experience

1. Module Development Engineer (Process Engineer)

   Intel

   Jul 2022 — Present · Hillsboro, OR, US

   Sustaining, Research, and Development: Responsible for day-to-day maintenance and sustaining of the Lithography process (Track and Stepper tools). Conducted process development to enable patterning of smaller CDs (vias), supporting Moore’s Law. Developed photoresist-based layers to address etch resist consumption issues, enabling hard mask usage. Developed a resist-based, low-cost alternative to edge exclusions to prevent flake formation. Performed failure analysis using Optical Microscopy, Scanning Electron Microscopy (SEM), and Energy Dispersive X-ray Spectroscopy (EDX). Utilized SQL, Power BI, SPC, PCSA, E3, QEF, and DRB tools to drive quality assurance and maximize production output. Received the Logic Technology Development Department Divisional Award in 2024 and 2025 for process improvements and defect reduction.Process Ownership & Cross-Functional Collaboration: TSV area champion for the implementation of the 8D (Eight Disciplines) problem-solving methodology. TSV project manager for ISO compliance (superuser) and Infinity package setup and implementation. Litho Module owner and representative of the TSV Quality and Efficiency Working Group. Power BI reports ownership: Manufacturing Availability, Area Status, and Quality (QEFs and DRBs).

Education

• Bangladesh University of Engineering and Technology

  B.Sc

  2010 — 2015

• Rutgers University–New Brunswick

  Doctor of Philosophy - PhD

  2018 — 2022

• Notre Dame College,Dhaka

  Higher Secondary School Certificate

  2007 — 2009

• The University of Texas at El Paso

  Master's degree in Mechanical Engineering

  2016 — 2018

• Ideal School and College,Motijheel,Dhaka

  Secondary School Certificate

  1999 — 2007