Mottaleb Hossain

Intel EMIB/FOVEROS TD Device Engineer

Role
Advanced Packaging (Emib Foveros) Td Device Engineer at Intel
Location
Albuquerque, NM, US
LinkedIn followers
500 followers

About Mottaleb Hossain

1) F11X EMIB TD Technology Enablement 2) Dry etch process development for Intel Embedded Multi-die Interconnect Bridge (Intel EMIB) as well as 3D Foveros technology [March 13, 2022 - fEB 28, 2026]; These include but are not limited to-provide solution for any critical dry-etch process issues using model based problem solving (MBPS) approach for EMIB & Foveros products-transfer developed process to HVM team3) Layer ownership as well as sustaining activities on the Intel Optane products (3D XPoint memory) in the following areas [Sept 03, 2019 - March 13, 2022]- dry-etch process development for CMOS MOL contacts [layer owner]- dry-etch (dielectric and conductor) pilot manufacturing [Array]- sustaining works on litho process development [Array]

Experience

  1. Advanced Packaging (Emib Foveros) Td Device Engineer

    Intel

    Mar 2026 — Present · Albuquerque, NM, US

Education

  • Khulna University of Engineering and Technology

    B.S., Electrical & Electronic Egineering

    2005 — 2009

  • University of New Mexico School of Engineering

    Ph.D., Optical Science & Engineering

  • Birganj Govt. Boys' High School, Dinajpur, Bngladesh

    SSC, Science

    1997 — 2002

  • Bir Shreshtha Noor Mohammad Rifles Public School and College, Dhaka, Bangladesh

    Primary (III-IV)

    1994 — 1995

  • University of New Mexico School of Engineering

    M.S., Optical Science & Engineering

  • Notre Dame College

    Higher Secondary Certificate (HSC), Science

    2002 — 2004

Skills

  • Electronics
  • Sensors
  • Optical Microscopy
  • C
  • Programming
  • Latex
  • Semiconductors
  • Nanofabrication
  • Optical and Electrical Characterization of Avalanche Photodiodes (Apds)
  • Optoelectronics
  • Optics
  • Photonics
  • Image Processing
  • C++
  • Research
  • Microsoft Office
  • Signal Processing
  • Simulink
  • Finite Element Analysis
  • Mathematical Modeling
  • Electrical Engineering
  • Algorithms
  • Power Electronics
  • Nanophotonics
  • Cmos Avalanche Photodiode (Apd)
  • Php
  • Vhdl
  • Simulations
  • Development of Algorithmic Spectral Sensor
  • Photovoltaics
  • Matlab
  • Labview
  • Engineering
  • Characterization
  • Materials
  • Computational Modeling with Synopsys Sentaurus Tcad
  • Spectroscopy
  • Light Communication
  • Science
  • Physics

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Mottaleb Hossain — Advanced Packaging (Emib Foveros) Td Device Engineer at Intel in Albuquerque, NM, US | Unifers