Asaduz Zaman Mamun
IC Package Engineer | EE PhD (Purdue)
- Role
- Ic Package Engineer at Micron Technology
- Location
- San Francisco, CA, US
- LinkedIn followers
- 500 followers
About Asaduz Zaman Mamun
Ph.D-trained IC Packaging Engineer with 5+ years of combined industry and academic…
Experience
Ic Package Engineer
Dec 2024 — Present · Boise, ID, US
Drive feasibility studies for high-speed SerDes flip-chip SiP, including logic integration and schematic development.Perform bump assignment, escape routing, and interconnect scheme optimization to support advanced substrate designs.Conduct SI/PI and reliability analysis, including impedance modeling, power delivery validation, electromigration, and Joule heating evaluations.Collaborate with cross-functional SI, PI, thermal, and reliability teams to achieve BER, Tx/Rx termination, and thermal compliance targets.
Education
Bangladesh University of Engineering and Technology
BS, EEE
2012 — 2017
Purdue University
Doctor of Philosophy - PhD, Device/Product Reliability, Design, Modelling, and Characterization
Bangladesh University of Engineering and Technology
MS, EEE
2017 — 2020
Notre Dame College
H.S.C, Science
2009 — 2011
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