Maydha K.
Semiconductor Packaging Engineer at Texas Instruments
- Role
- Semiconductor Packaging Engineer at Texas Instruments
- Location
- Dallas, TX, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
Experience
Semiconductor Packaging Engineer
Sep 2022 — Present · Dallas, TX, US
I work primarily with our internal assembly and test sites (located internationally) to enable TI\'s products in manufacturable, scalable solutions, specifically in wirebond QFN packages.
Education
The University of Texas at Austin
Bachelor of Science - BS, Mechanical Engineering
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