Massimo Mazzillo
Compound Semiconductors Technology Director Deputy Chief Expert Sic Manufacturing Process @Huawei
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WORK HISTORY
Compound Semiconductors Technology Director Deputy Chief Expert Sic Manufacturing Process @Huawei
Munich, DE
In charge for leading compound semiconductors technology development activities for different applications, with major focus on SiC power devices. In this role I am responsible for: • Definition and drive to deployment of technology strategy and roadmap of compound semiconductors, including SiC power process and device technology; • Building up team and technology core capabilities; • Derivation of device design, process flow and characterization plan from specifications;• Development of new device and process concepts; • Leading prototypes development for proof of concept and transfer to production; • Collaboration with leading experts and initiation of cooperations for project delivery.
EDUCATION
Università degli Studi di Bari
110/110 cum laude, MS in Physics-Optoelectronics
SKILLS
ABOUT MASSIMO MAZZILLO
Semiconductor technology professional with outstanding experience gained in leading technology firms (Huawei, Nexperia, Valeo, Osram, STMicroelectronics) as global technical leader for strategic projects aimed to the development of novel device and process technologies, with deep focus on sensors and power devices design and silicon and wide bandgap materials (SiC, GaN) processing.CORE SKILLS • Strong knowledge in semiconductor device physics and technology;• Wide experience in novel microelectronics and optoelectronics discrete and integrated technologies development from the idea to the industrialization, including definition of new devices concept, TCAD simulations, mask set design, process flow integration, electro-optical and morphological characterization, packaging, testing and reliability tests planning and evaluation;• Extensive knowledge in silicon and compound semiconductor (e.g. SiC, GaN, InGaAs, InGaAlP) manufacturing technologies, surface and solids analyses techniques and electro-optical characterization methods;• Broad expertise in the design and technology integration of advanced sensor (optical, inertial and environmental) and power microelectronics technologies;• Deep knowledge in the design of silicon (custom/CMOS) and semiconductor compound avalanche photodiodes (APDs, SPADs, SiPMs) and time-of-flight (ToF) imaging technologies; • Extensive know-how in the design and technology integration of wide band gap power devices with deep focus on SiC power devices (SBs, JBS, PN and MPS diodes, Planar and Trench MOSFETs);• Good insight into the industrial and automotive quality standards and requirements;• Strategic technology and innovation management;• Management of industrial and funded projects, external partnerships and co-operations; • Relevant contribution to the innovation and scientific results dissemination through a consistent record of patent family applications (66)(55-US Granted), publications in high impact factor journals (110+) and communications to international conferences (80+); • Experience in direct and functional people management in international and multicultural environments;• Analytical skills, creativity, flexibility, aptitude to teamwork and problem solving, determination and care in result obtainment, work and leadership in highly-competitive environments.
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