Martin We
Sr Staff Packaging Engineer @高通
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WORK HISTORY
Sr Staff Packaging Engineer @高通
Lead substrate D2D connection technology development • High-end FCBGA (AI, 5G, Computing) interconnection technology development • Premium tier AP thickness reduction development • FORDL-POP package development and concept evaluation • Modified FO technology and product development for mobile application • Module miniaturization technology development for mobile, automotive, wearable application and process define after concept generation • FOWLP integration especially high volume panel concept development • Lead high density organic 2.1D/2.5D interposer development and project integration • 2.5D/3D interposer process integration • Lead Glass interposer process development, DRM, process risk assessment • eWLB metallization and fine pattern RDL process development • Team member of Silicon interposer and modified Silicon interposer development
EDUCATION
Gyeongsang National University
Bachelor's degree, Materials Science
Gyeongsang National University
Master's degree, Materials Engineering
ABOUT MARTIN WE
Premium tier AP package and module development • Various FORDL-POP package…
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