Mark MacNoll

About Mark MacNoll

I am currently a Process Engineer at Texas Instruments working in semiconductor manufacturing. In this role I specialize in improving process efficiency, reducing costs, maintaining production operations, and ensuring high product quality for our many customers. I am proud to contribute to the culture of innovation, collaboration, and ethics that is so prominent at Texas Instruments. With all the tools and experiences I have developed, I am dedicated to keeping TI at the forefront of semiconductor manufacturing for generations to come.

Experience

1. Process Engineer

   Texas Instruments

   Sep 2020 — Present · Richardson, TX, US

   Served as process owner at RFAB 300 mm semiconductor manufacturing site. Performed operational and project related functions associated with the maintenance and improvement of chip fabrication processes.CMP Process Engineer• Managed team of 7 process techs to best respond to and mitigate production quality issues. • Qualified and released new CMP tools to expand production capacity.• Conducted design of experiments to determine root causes of quality issues.• Designed and implemented changes to standard production processes to increase yield and minimize defects.• Optimized tool availability and reduced costs by qualifying new processes and consumables.• Implemented new wafer CMP reclean process for recycling non-production material.• Appointed to spearhead initiatives to solve department production challenges.• Created and delivered presentations to engineering student organizations as part of the UT Austin recruiting team.Plasma Process EngineerRotational position for Texas Instruments rotation program. In this role I completed projects on various processes in the Plasma module:• Qualified ThinFilm Resistor Via and PO Via Ash processes on Plasma ashers.• Collected parametric and critical dimension (CD) data to release 1 micron and 3 micron metal etch on multiple metal etchers for production capacity increase.• Led team of 3 to implement advanced process control on etch rate quals for Deep Trench 2 Silicon Etch.

Education

• The University of Texas at Austin

  Chemistry, Bachelor of Science (BS), GPA 3.96/4.0

  2015 — 2020

• Columbia Business School

  Master of Business Administration - MBA

• The University of Texas at Austin

  Chemical Engineering, Bachelor of Science (BS), GPA 3.96/4.0

  2015 — 2020